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| Name |
Size |
"Chip-Package Resonance in Core Power Supply Structures for a High Power Microprocessor" Published in the Proceedings of IPACK'01, the Pacific Rim/ASME International Electronics Packaging Technical Conference and Exhibition, July 8-13, 2001, Kauai, Hawaii USA by Larry Smith, Raymond Anderson, Tanmoy Roy, all of Sun Microsystems |
310 KB |
"Power Distribution system Design Methodology and Capacitor selection for Modern CMOS Technology" Manuscript of paper published in IEEE Transaction on Advanced Packaging, august, 1999 pp284-291 by Larry smith, Raymond Anderson, Doug Forehand, Tom Pelc, and Tanmoy Roy, all of Sun Microsystems Inc. |
139 KB |
"Power Plane SPICE Models and Simulated Performance for Materials and Geometries" Manuscript of paper published in IEEE Transactions on Advanced Packaging, August 2001 edition by Larry Smith, Raymond Anderson,and Tanmoy Roy. |
630 KB |
"Distributed SPICE Circuit Model for Ceramic Capacitors" Presented at IEEE ECTC Conference, Lake Buena Vista, Florida May 29-June 1, 2001 by Larry Smith and David Hockanson of Sun Microsystems |
313 KB |
"A Transmission-Line Model for Ceramic Capacitors for CAD Tools Based on Measured Parameters" Published in the Conference Record, Electrical Components Technology Conference (ECTC) May 2002, San Diego, Calif. by Larry D. Smith, David Hockanson, Krina Kothari, all of Sun Microsystems Inc. |
396 KB |
"Model to Hardware Correlation for Power Distribution Induced I/O Noise in a Functioning Computer System" Published in the Conference Record of ECTC 2002 at San Diego, Calif. by Sungjun Chun (GaTech) , Larry Smith, Ray Anderson (both of Sun Microsystems), and Madhavan Swaminathan (GaTech) |
236 KB |
"ESR and ESL of Ceramic Capacitors Applied to Decoupling Applications" presented at the IEEE Electrical Performance of Electronic Packaging Conference (EPEP) Oct. 1998 by Larry Smith of Sun Microsystems and John Prymak of Kemet Electronic Corporation. |
20 KB |
"simultaneous Switch Noise and Power Plane Bounce for CMOS Technology" presented at the IEEE electrical Performance of Electrical Packaging (EPEP) Conference, San Diego, CA Oct 17-25, 1999 by Larry Smith of Sun Microsystems |
30 KB |
"Power Plane Spice Models for Frequency and Time Domains" presented at the IEEE Performance of Electrical Packaging (EPEP) Conference 2000 (EPEP 2000), October, 2000 at Scottsdale, Arizona by Larry Smith, Raymond Anderson, and Tanmoy Roy all of Sun Microsystems. |
69 KB |
"Power Distribution System for JEDEC DDR2 Memory DIMM" published in Conference Record, IEEE Electrical Performance of Electronic Packages 2003 (EPEP 2003), Princeton, NJ, .pp 121-124 Oct 2003 by Larry D. Smith and Jeffrey Lee of Sun Microsystems Inc.
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293 KB
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